NBS Special PublicationU.S. Department of Commerce, National Bureau of Standards, 1964 - 9 pages |
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Page 3
... shown in figure 1 , A is the depletion width on the heavily - doped side of the junction , B is the depletion width on the lightly - doped side of the junction , N ( A ) and N ( B ) are the respective net dopant densities at distances A ...
... shown in figure 1 , A is the depletion width on the heavily - doped side of the junction , B is the depletion width on the lightly - doped side of the junction , N ( A ) and N ( B ) are the respective net dopant densities at distances A ...
Page 11
... shown in figure 5. There are six possible ways in which the data point may appear in the plot . ( 1 ) If Y2 < 3 , the data point is off scale at the low end ( dopant density too small ) ; this is represented by the symbol < to the left ...
... shown in figure 5. There are six possible ways in which the data point may appear in the plot . ( 1 ) If Y2 < 3 , the data point is off scale at the low end ( dopant density too small ) ; this is represented by the symbol < to the left ...
Page 25
... given in [ 10 ] is shown below . The calculation , which occupies three pages in this report , consists of four parts ... shown in figure 5 . In the third part , following LIST NBVSB , the values of N ( B ) in ( centimetres ) -3 and B in ...
... given in [ 10 ] is shown below . The calculation , which occupies three pages in this report , consists of four parts ... shown in figure 5 . In the third part , following LIST NBVSB , the values of N ( B ) in ( centimetres ) -3 and B in ...
Page 6
... shown in fig- ure 1. The critical aspect of the design and fabrication is the achievement of a liquid - tight seal around the area to be an- odized . In the apparatus shown the seal is made by pressing the specimen against a TFE ...
... shown in fig- ure 1. The critical aspect of the design and fabrication is the achievement of a liquid - tight seal around the area to be an- odized . In the apparatus shown the seal is made by pressing the specimen against a TFE ...
Page 8
... figure for two typical cooling rates . Nevertheless , electrons occupy only a very small fraction of the defects and ... shown by the dotted line in figure 3. During warm up the electron density on the defects in the initially uncharged ...
... figure for two typical cooling rates . Nevertheless , electrons occupy only a very small fraction of the defects and ... shown by the dotted line in figure 3. During warm up the electron density on the defects in the initially uncharged ...
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aluminum analysis angle Appendix applied automation bond pull test Bureau of Standards calibration capacitance Center conversion loss curve detector determined device under test diffusion diode dopant density edge effect electrical electron beam emitter energy epitaxial error eyepiece fabrication filar frequency germanium heating impurity industry input integrated circuits intermediate-frequency junction temperature Laboratory layer leak loop height mask Materials measured pull strength ment method microscope mixer modulation MOS capacitor National Bureau NBS Spec noise noise figure obtained operating optical output oxide p-n junction parameters percent PHOTOLITHOGRAPHY photomask plot Power Transistors PRINT probe process control Publ Radiation region Resistance Measurements resistor scanning electron microscope semiconductor devices Semiconductor Measurement Technology sheet resistance shown in figure silicon silicon dioxide specimen Subcommittee substrate surface switching Technical techniques test patterns test structures thermal resistance thickness tion two-level bond values voltage wafer wire bonds