Handbook of Low and High Dielectric Constant Materials and Their Applications: Phenomena, properties, and applicationsHari Singh Nalwa Academic Press, 1999 |
From inside the book
Results 1-3 of 14
Page xiii
... copper / SiO2 interconnects and to move towards integrating low dielectric constant materials with copper instead of aluminum interconnects . As the lower resistance is important for microprocessors and fast memory chips , the DRAM ...
... copper / SiO2 interconnects and to move towards integrating low dielectric constant materials with copper instead of aluminum interconnects . As the lower resistance is important for microprocessors and fast memory chips , the DRAM ...
Page 40
... copper target dishes . The PLZT thin films were prepared from powder targets using a rf - magnetron sputtering system manufactured by Kurt J. Lesker , Inc. The deposition conditions employed in the PLZT sputtering are listed in Table ...
... copper target dishes . The PLZT thin films were prepared from powder targets using a rf - magnetron sputtering system manufactured by Kurt J. Lesker , Inc. The deposition conditions employed in the PLZT sputtering are listed in Table ...
Page 529
... Copper 10,000 0 0 10 20 30 40 50 60 Size ( mm ) Fig . 26. Comparison of the effect of end plate separation on the Q of a dielectric resonator at 2 GHz and 77 K for thick and thin film HTS and copper end plates . The dielectric is ZTS ...
... Copper 10,000 0 0 10 20 30 40 50 60 Size ( mm ) Fig . 26. Comparison of the effect of end plate separation on the Q of a dielectric resonator at 2 GHz and 77 K for thick and thin film HTS and copper end plates . The dielectric is ZTS ...
Contents
Size Effects in Ferroelectric Powders | 61 |
Theoretical Treatments of Size Effects in BaTiO3 | 101 |
Conclusion and Outlook to Future Trends | 108 |
Copyright | |
26 other sections not shown
Common terms and phrases
acoustic annealing Appl applications BaTiO3 breakdown capacitance capacitor ceramic charge distribution components composite copolymer crystal crystallites cubic current density decrease dependence deposition detrapping devices dielectric constant dielectric loss dielectric materials dielectric resonator dielectric strength dipole effect electric field electrical breakdown electromechanical energy electron energy density factor ferroelectric foil edge frequency grain heat high-voltage IEEE Trans impregnant increase injection insulation laminate laser lattice layer leakage current liquid measured mechanical metal MOCVD parameters partial discharge peak permittivity perovskite phase photons Phys piezoelectric PLZT polarization poling polymer precursor properties pulse PVDF pyroelectric pyroelectric coefficient pyroelectric profile reduced Reprinted with permission room temperature sample shown in Figure silicon Singh sintering solid space-charge stress structure substrate surface tantalum technique tetragonal thermal thickness thin films transformers trapped charge VDF-TrFE copolymer voltage