NBS Technical NoteU.S. Government Printing Office, 1974 |
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... Wire Bonds from High - Reliability U.S. MENT OF ERCE ational Bureau of dards Devices NATIONAL BUREAU OF STANDARDS The National Bureau of Standards '. UNITED.
... Wire Bonds from High - Reliability U.S. MENT OF ERCE ational Bureau of dards Devices NATIONAL BUREAU OF STANDARDS The National Bureau of Standards '. UNITED.
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... address Washington , D.C. 20234 . 2 Part of the Center for Radiation Research . 3 Located at Boulder , Colorado 80302 . Part of the Center for Building Technology . Scanning Electron Microscope Examination of Wire Bonds from High -
... address Washington , D.C. 20234 . 2 Part of the Center for Radiation Research . 3 Located at Boulder , Colorado 80302 . Part of the Center for Building Technology . Scanning Electron Microscope Examination of Wire Bonds from High -
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Scanning Electron Microscope Examination of Wire Bonds from High - Reliability Devices Kathryn O. Leedy Electronic Technology Division Institute for Applied Technology National Bureau of Standards Washington , D.C. 20234 DEPARTMENT ...
Scanning Electron Microscope Examination of Wire Bonds from High - Reliability Devices Kathryn O. Leedy Electronic Technology Division Institute for Applied Technology National Bureau of Standards Washington , D.C. 20234 DEPARTMENT ...
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... bonds from another production line Examples of different types of first - bond heel cracks Variation in bond ... wire during bonding Differences in surface texture of the deformed wire 11 11 12 12 . A bond apparently produced by a ...
... bonds from another production line Examples of different types of first - bond heel cracks Variation in bond ... wire during bonding Differences in surface texture of the deformed wire 11 11 12 12 . A bond apparently produced by a ...
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... wire bonds on transistor chips 27. Misalignment caused by poor masking . 28 . Examples of extraneous material . • • · 25 26 2 20 27 SCANNING ELECTRON MICROSCOPE EXAMINATION OF WIRE BONDS FROM HIGH -
... wire bonds on transistor chips 27. Misalignment caused by poor masking . 28 . Examples of extraneous material . • • · 25 26 2 20 27 SCANNING ELECTRON MICROSCOPE EXAMINATION OF WIRE BONDS FROM HIGH -
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analysis Annual subscription areas asphalt tile automatic data processing Building Technology Bureau of Standards Bus-line cap gun carpet Center for Building circuit clean coating codes concrete slab concrete subfloor condition configuration connector cooling cost cracks crate cutting plants Dataway DEPARTMENT OF COMMERCE devices electrical electron energy conservation Engineering epoxy equipment Evaluation FAIRLY SATISFACTORY function Government heat industry integrated circuit laboratory loop Magnification maintenance Materials MESS HALL KITCHEN metallization methods MIDAS module National Bureau NBS Technical Note Office operating p-n junctions PASS1 PASS2 PASS3 percent Polyester polyurethane problem provides pull strength request route SATISFACTORY INSTALLATIONS scanning electron microscope Section shown in Figure silicon slab on grade sound pressure levels Standard Reference subnetwork Subroutine Table Telpak temperature terrazzo thermal thin-set terrazzo tool traffic transistor trowel-on U.S. DEPARTMENT viscosity wire bonds
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Page 43 - In no case does such identification imply recommendation or endorsement by the National Bureau of Standards, nor does it imply that the material or equipment identified is necessarily the best available for the purpose.
Page 49 - ... Superconducting Devices and Materials. A literature survey issued quarterly. Annual subscription: $20.00. Send subscription orders and remittances for the preceding bibliographic services to the US Department of Commerce, National Technical Information Service, Springfield, Va. 22151. Electromagnetic Metrology Current Awareness Service (Abstracts of Selected Articles on Measurement Techniques and Standards of Electromagnetic Quantities from DC to Millimeter- Wave Frequencies).
Page 49 - This series consists of communications and reports (covering both other-agency and NBS-sponsored work) of limited or transitory interest. Federal Information Processing Standards Publications. This series is the official publication within the Federal Government for information on standards adopted and promulgated under the Public Law 89—306, and Bureau of the Budget Circular A-86 entitled, Standardization of Data Elements and Codes in Data Systems.
Page 73 - Comprehensive scientific papers give complete details of the work, including laboratory data, experimental procedures, and theoretical and mathematical analyses. Illustrated with photographs, drawings, and charts.