NBS Technical NoteU.S. Government Printing Office, 1974 |
From inside the book
Results 1-5 of 63
Page
... interfering with bonding 16 18. Rebonding on the package leads 17 · 19. Rebonding on the bonding pads on the circuit chip 18 20 . Rebonding following wire break - off at the heel . 19 21 22 23 24 24 2 23 21. Defective package iv.
... interfering with bonding 16 18. Rebonding on the package leads 17 · 19. Rebonding on the bonding pads on the circuit chip 18 20 . Rebonding following wire break - off at the heel . 19 21 22 23 24 24 2 23 21. Defective package iv.
Page 1
... circuit configuration . In fact , most of the faults were observed to some extent in all types of the devices investi- gated . 2. BACKGROUND In order to obtain perspective of the problem and to define some terms , let us look first at ...
... circuit configuration . In fact , most of the faults were observed to some extent in all types of the devices investi- gated . 2. BACKGROUND In order to obtain perspective of the problem and to define some terms , let us look first at ...
Page 2
... circuit chip electrically to the external lead : a post or finger of the package in which the chip is held . The welded interface between the wire and the pad , post , or finger , under the flattened areas at the ends of the wire , are ...
... circuit chip electrically to the external lead : a post or finger of the package in which the chip is held . The welded interface between the wire and the pad , post , or finger , under the flattened areas at the ends of the wire , are ...
Page 3
a Magnification : 22X b Magnification : 22X An integrated circuit is shown in ( a ) and a transistor in ( b ) . Magnification : 540X Figure 2. The lift - off pattern of a partially removed bond made under laboratory conditions . A ...
a Magnification : 22X b Magnification : 22X An integrated circuit is shown in ( a ) and a transistor in ( b ) . Magnification : 540X Figure 2. The lift - off pattern of a partially removed bond made under laboratory conditions . A ...
Page 14
... circuit . A typical example of such a mark is shown in Figure 15. It is possible for the probe to completely scrape away the metallization as is shown in Figure 16. In any case the metallization may be scraped quite thin by the probe so ...
... circuit . A typical example of such a mark is shown in Figure 15. It is possible for the probe to completely scrape away the metallization as is shown in Figure 16. In any case the metallization may be scraped quite thin by the probe so ...
Other editions - View all
Common terms and phrases
analysis Annual subscription areas asphalt tile automatic data processing Building Technology Bureau of Standards Bus-line cap gun carpet Center for Building circuit clean coating codes concrete slab concrete subfloor condition configuration connector cooling cost cracks crate cutting plants Dataway DEPARTMENT OF COMMERCE devices electrical electron energy conservation Engineering epoxy equipment Evaluation FAIRLY SATISFACTORY function Government heat industry integrated circuit laboratory loop Magnification maintenance Materials MESS HALL KITCHEN metallization methods MIDAS module National Bureau NBS Technical Note Office operating p-n junctions PASS1 PASS2 PASS3 percent Polyester polyurethane problem provides pull strength request route SATISFACTORY INSTALLATIONS scanning electron microscope Section shown in Figure silicon slab on grade sound pressure levels Standard Reference subnetwork Subroutine Table Telpak temperature terrazzo thermal thin-set terrazzo tool traffic transistor trowel-on U.S. DEPARTMENT viscosity wire bonds
Popular passages
Page 43 - In no case does such identification imply recommendation or endorsement by the National Bureau of Standards, nor does it imply that the material or equipment identified is necessarily the best available for the purpose.
Page 49 - ... Superconducting Devices and Materials. A literature survey issued quarterly. Annual subscription: $20.00. Send subscription orders and remittances for the preceding bibliographic services to the US Department of Commerce, National Technical Information Service, Springfield, Va. 22151. Electromagnetic Metrology Current Awareness Service (Abstracts of Selected Articles on Measurement Techniques and Standards of Electromagnetic Quantities from DC to Millimeter- Wave Frequencies).
Page 49 - This series consists of communications and reports (covering both other-agency and NBS-sponsored work) of limited or transitory interest. Federal Information Processing Standards Publications. This series is the official publication within the Federal Government for information on standards adopted and promulgated under the Public Law 89—306, and Bureau of the Budget Circular A-86 entitled, Standardization of Data Elements and Codes in Data Systems.
Page 73 - Comprehensive scientific papers give complete details of the work, including laboratory data, experimental procedures, and theoretical and mathematical analyses. Illustrated with photographs, drawings, and charts.