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Page 42
When the copper preplating was made substantially thicker , complete dissolution of the copper into the tin - lead solder did not occur and dewetting was not noted . However , not all joints were acceptable , due to separation at the ...
When the copper preplating was made substantially thicker , complete dissolution of the copper into the tin - lead solder did not occur and dewetting was not noted . However , not all joints were acceptable , due to separation at the ...
Page 299
Contents : Anodic Dissolution of Iron Group Metals , Wolfgang L. Lorenz and Konrad E. Heusler . Alloy Dissolution , Herman Kaiser . Corrosion Inhibitors , Giordano Trabanelli . Coatings , Henry Leidheiser , Jr. Atmospheric Corrosion ...
Contents : Anodic Dissolution of Iron Group Metals , Wolfgang L. Lorenz and Konrad E. Heusler . Alloy Dissolution , Herman Kaiser . Corrosion Inhibitors , Giordano Trabanelli . Coatings , Henry Leidheiser , Jr. Atmospheric Corrosion ...
Page 396
7. STRAIN RATE r r d ' $ r The occurence of SCC requires some critical balance between tensile stress and corrosion . Three factors , i.e. , strain rate ( V. ) , dissolution rate at slip steps ( V. ) and repassivation rate of ruptured ...
7. STRAIN RATE r r d ' $ r The occurence of SCC requires some critical balance between tensile stress and corrosion . Three factors , i.e. , strain rate ( V. ) , dissolution rate at slip steps ( V. ) and repassivation rate of ruptured ...
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